Patent Assignment
Reel/Frame 045380/0285
Assignment of Assignor's Interest
Recorded: 2018-03-29
Pages: 4
Assignors
CHEN, YI-HSIU
Executed: 2018-03-16
YU, CHEN-HUA
Executed: 2018-03-19
CHEN, MING-FA
Executed: 2018-03-19
CHIOU, WEN-CHIH
Executed: 2018-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Package Structure