IP Library › Assignment 045382/0767
Patent Assignment
Reel/Frame 045382/0767

Assignment of Assignor's Interest

Recorded: 2018-03-29 Pages: 7
Assignors
WANG, HUI
Executed: 2015-10-22
CHU, ALEX
Executed: 2015-10-22
GRABBE, ALEXIS
Executed: 2015-11-03
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property (1)
Methods for Processing Semiconductor Wafers Having a Polycrystalline Finish
Application: 15/764,272 →
Publication: US 2018/0323079
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →