Patent Assignment
Reel/Frame 045386/0660
Assignment of Assignor's Interest
Recorded: 2018-03-29
Pages: 12
Assignors
SU, LEI
Executed: 2018-02-05
YANG, XIAOFEI
Executed: 2018-02-05
LIU, XU
Executed: 2018-02-04
MOU, XUN
Executed: 2018-02-05
ZHU, YAWEN
Executed: 2018-02-05
Assignees
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188 HEZUO RD., (WEST ZONE), HI-TECH, DEVELOPMENT ZONE, SICHUAN PROVINCE, CHENGDU, 611731, CHINA
Covered Property
(1)
Via-hole Connection Structure And Method Of Manufacturing The Same, And Array Substrate And Method Of Manufacturing The Same