IP Library › Assignment 045394/0562
Patent Assignment
Reel/Frame 045394/0562

Assignment of Assignor's Interest

Recorded: 2018-03-30 Pages: 5
Assignors
HUANG, SHIH-CHUN
Executed: 2018-03-08
LIN, CHIN-HSIANG
Executed: 2018-03-15
WEN, LAI CHIEN
Executed: 2018-03-12
LIU, RU-GUN
Executed: 2018-03-13
LIN, WEI-LIANG
Executed: 2018-03-14
CHANG, YA HUI
Executed: 2018-03-14
YEN, YUNG-SUNG
Executed: 2018-03-08
SHEN, YU-TIEN
Executed: 2018-03-08
YEH, YA-WEN
Executed: 2018-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Directional Processing to Remove a Layer or a Material Formed Over a Substrate
Application: 15/812,750 →
Publication: US 2019/0148145
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Previously Recorded at Reel: 045394 Frame: 0562. Assignor(S) Hereby Confirms the Assignment. Jun 6, 2019
From: HUANG, SHIH-CHUN; LIN, CHIN-HSIANG; LAI, CHIEN-WEN; LIU, RU-GUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 049403/0244 →