Patent Assignment
Reel/Frame 045435/0410
Assignment of Assignor's Interest
Recorded: 2018-04-04
Pages: 3
Assignors
WANG, ZHIQI
Executed: 2018-03-23
WANG, ZHUOWEI
Executed: 2018-03-21
XIE, GUOLIANG
Executed: 2018-03-21
Assignee
CHINA WAFER LEVEL CSP CO. LTD.
NO. 29 TINGLAN LANE SIP, SUZHOU, JIANGSU, 215026, CHINA
Covered Property
(1)
Packaging Method and Package Structure for Image Sensing Chip