Patent Assignment
Reel/Frame 045441/0593
Assignment of Assignor's Interest
Recorded: 2018-02-26
Pages: 5
Assignors
LEE, DOO HWAN
Executed: 2016-12-05
KIM, JONG RIP
Executed: 2016-12-05
KIM, HYOUNG JOON
Executed: 2016-12-05
KIM, JIN YUL
Executed: 2016-12-05
OH, KYUNG SEOB
Executed: 2016-12-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.