Patent Assignment
Reel/Frame 045459/0752
Assignment of Assignor's Interest
Recorded: 2018-04-06
Pages: 4
Assignors
CHEN, WEI-YU
Executed: 2018-02-13
SU, AN-JHIH
Executed: 2018-02-19
YEH, DER-CHYANG
Executed: 2018-02-21
HUANG, LI-HSIEN
Executed: 2018-02-13
YEH, MING SHIH
Executed: 2018-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method