Patent Assignment
Reel/Frame 045460/0538
Assignment of Assignor's Interest
Recorded: 2018-04-06
Pages: 5
Assignors
PEI, HAO-JAN
Executed: 2018-03-19
CHEN, WEI-YU
Executed: 2018-03-19
CHENG, CHIA-SHEN
Executed: 2018-03-19
TSAO, CHIH-CHIANG
Executed: 2018-03-21
CHEN, CHENG-TING
Executed: 2018-03-22
CHANG, CHIA-LUN
Executed: 2018-03-22
LIN, CHIH-WEI
Executed: 2018-03-22
LIN, HSIU-JEN
Executed: 2018-03-22
HSIEH, CHING-HUA
Executed: 2018-03-26
LIU, CHUNG-SHI
Executed: 2018-03-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Fan-Out Packages with Embedded Heat Dissipation Structure