Patent Assignment
Reel/Frame 045461/0770
Assignment of Assignor's Interest
Recorded: 2018-04-06
Pages: 4
Assignee
MITSUBISHI ENGINEERING-PLASTICS CORPORATION
9-2, HIGASHI-SHINBASHI 1-CHOME, MINATO-KU, TOKYO, 105-0021, JAPAN
Covered Property
(1)
Resin Composition, Resin Molding, Method for Manufacturing Plated Resin Molding, and Method for Manufacturing Antenna-Equipped Portable Electronic Device Part
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.