Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device part
Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.
1. A resin composition comprising:
100 parts by weight of a thermoplastic resin;
5 to 100 parts by weight of a halogen-containing flame retarder; and,
1 to 30 parts by weight of a laser direct structuring additive,
wherein the laser direct structuring additive contains antimony and tin, with a content of tin larger than a content of antimony, and;
a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin,
wherein the antimony-containing flame retarder auxiliary is an antimony oxide, sodium antimonite, or antimony phosphate.
2. The resin composition of claim 1 , further comprising 10 to 150 parts by weight of an inorganic filler per 100 parts by weight of the thermoplastic resin.
3. The resin composition of claim 2 , wherein the inorganic filler is a glass fiber.
4. The resin composition of claim 1 , wherein a content of antimony in the resin composition is 0.1% by weight or more.
5. The resin composition of claim 1 , wherein the thermoplastic resin is a polyamide resin.
6. The resin composition of claim 1 , wherein the laser direct structuring additive contains at least one of antimony oxide and tin oxide.
7. The resin composition of claim 1 , wherein the halogen-containing flame retarder contains a brominated polystyrene resin.
8. The resin composition of claim 1 , which satisfies V-0 in UL 94 test, when the resin composition is formed into a resin molding with an average thickness of 1.5 mm.
9. A resin molding, obtainable by molding the resin composition described in claim 1 .
10. The resin molding of claim 9 , having a plating on a surface thereof.
11. The resin molding of claim 10 , wherein the plating serves as an antenna.
12. The resin molding of claim 9 , which is a portable electronic device part.
13. A method for manufacturing a plated resin molding comprising forming a plating by irradiating laser on a surface of a resin molding obtainable by molding the resin composition described in claim 1 , and then by applying a metal.
14. The method for manufacturing a plated resin molding of claim 13 , wherein the plating is a copper plating.
15. A method for manufacturing an antenna-equipped portable electronic device part, comprising the method for manufacturing a plated resin molding described in claim 13 .
16. The resin composition of claim 1 , wherein the laser direct structuring additive is a compound that can form a plating layer on a laser-irradiated surface.
17. The resin composition of claim 1 , wherein the laser direct structuring additive and the antimony-containing flame retarder auxiliary are not the same.