Patent Assignment
Reel/Frame 045477/0597
Assignment of Assignor's Interest
Recorded: 2018-03-01
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-02-08
WANG, CHUEI-TANG
Executed: 2018-02-08
HSIA, HSING-KUO
Executed: 2018-02-08
LIAO, YU-KUANG
Executed: 2018-02-08
CHANG, CHIH-CHIEH
Executed: 2018-02-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Interconnect Device and Method