IP Library Assignment 045482/0203
Patent Assignment
Reel/Frame 045482/0203

Assignment of Assignor's Interest

Recorded: 2018-04-09 Pages: 4
Assignors
KIM, YOON SU
Executed: 2016-10-13
BAEK, SEUNG MIN
Executed: 2016-10-13
KO, YOUNG GWAN
Executed: 2016-10-13
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package and Method of Manufacturing the Same
Application: 15/948,535 →
Publication: US 2018/0233433
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →