Patent Assignment
Reel/Frame 045505/0156
Assignment of Assignor's Interest
Recorded: 2018-04-11
Pages: 13
Assignor
WATANABE, KENICHI
Executed: 2014-05-23
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Semiconductor Device Having Groove-Shaped Via-Hole
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.