Patent Assignment
Reel/Frame 045513/0898
Assignment of Assignor's Interest
Recorded: 2018-03-07
Pages: 5
Assignors
LEE, JI HYUN
Executed: 2016-09-05
HARR, KYOUNG MOO
Executed: 2016-09-05
KOOK, SEUNG YEOP
Executed: 2016-09-05
KIM, JI HOON
Executed: 2016-09-05
KO, YOUNG GWAN
Executed: 2016-09-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Method of Manufacturing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.