Patent Assignment
Reel/Frame 045516/0259
Assignment of Assignor's Interest
Recorded: 2018-04-12
Pages: 8
Assignors
KASAI, RYOHEI
Executed: 2018-04-08
TSUNODA, TSUYOSHI
Executed: 2018-03-27
YAMAMOTO, YUICHI
Executed: 2018-03-29
SAGARA, SHUJI
Executed: 2018-03-29
TANAKA, MASAYA
Executed: 2018-03-29
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1-1, ICHIGAYA KAGACHO, SHINJUKU-KU, TOKYO, 1628001, JAPAN
Covered Property
(1)
Mounting Component, Wiring Substrate, Electronic Device and Manufacturing Method Thereof