Patent Assignment
Reel/Frame 045519/0215
Assignment of Assignor's Interest
Recorded: 2018-04-12
Pages: 4
Assignors
HSIEH, CHENG-HSIEN
Executed: 2017-09-05
HSU, LI-HAN
Executed: 2017-09-05
WU, WEI-CHENG
Executed: 2017-09-05
CHEN, HSIEN-WEI
Executed: 2017-09-05
YEH, DER-CHYANG
Executed: 2018-03-12
WU, CHI-HSI
Executed: 2018-03-12
YU, CHEN-HUA
Executed: 2018-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Vias in Semiconductor Packages and Methods of Forming Same