Patent Assignment
Reel/Frame 045536/0192
Assignment of Assignor's Interest
Recorded: 2018-04-13
Pages: 4
Assignors
HU, GUANGLI
Executed: 2016-03-04
JOSHI, DHANANJAY
Executed: 2018-04-06
PARK, EUNYOUNG
Executed: 2018-04-06
QAROUSH, YOUSEF KAYED
Executed: 2018-04-10
Assignee
CORNING INCORPORATED
SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Bendable Electronic Device Modules, Articles and Methods of Making the Same