IP Library Assignment 045536/0388
Patent Assignment
Reel/Frame 045536/0388

Assignment of Assignor's Interest

Recorded: 2018-04-13 Pages: 3
Assignors
TEIG, STEVEN L.
Executed: 2018-03-23
DUONG, KENNETH
Executed: 2018-03-19
DELACRUZ, JAVIER
Executed: 2018-03-20
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Time Borrowing Between Layers of a Three Dimensional Chip Stack
Application: 15/859,546 →
Publication: US 2019/0042912
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 19, 2025
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 073635/0460 →