IP Library Assignment 073635/0460
Patent Assignment
Reel/Frame 073635/0460

Change of Name

Recorded: 2025-11-19 Pages: 5
Assignor
XCELSIS CORPORATION
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (24)
Wafer Testing Without Direct Probing
Application: 15/388,130 →
Publication: US US20180180665A1
Time Borrowing Between Layers of a Three Dimensional Chip Stack
Application: 15/859,546 →
Publication: US US20190042912A1
Three Dimensional Chip Structure Implementing Machine Trained Network
Application: 15/859,548 →
Publication: US US20190043832A1
Self Repairing Neural Network
Application: 15/859,612 →
Publication: US US20190042377A1
Three Dimensional Circuit Implementing Machine Trained Network
Application: 15/859,551 →
Publication: US US20190042929A1
Time Borrowing Between Layers of a Three Dimensional Chip Stack
Application: 16/891,027 →
Publication: US US20200293872A1
Stacked Ic Structure with System Level Wiring on Multiple Sides of the Ic Die
Application: 15/976,809 →
Publication: US US20180331037A1
Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die
Application: 16/806,934 →
Publication: US US20200273798A1
3D Chip Sharing Power Interconnect Layer
Application: 15/976,815 →
Publication: US US20180330992A1
3D Chip Sharing Power Circuit
Application: 15/976,817 →
Publication: US US20180330993A1
3D Chip Sharing Clock Interconnect Layer
Application: 15/976,821 →
Publication: US US20180350775A1
3D Chip Sharing Data Bus
Application: 15/976,823 →
Publication: US US20180331038A1
3D Chip Sharing Data Bus Circuit
Application: 15/976,827 →
Publication: US US20180331094A1
3D Chip with Shielded Clock Lines
Application: 15/976,828 →
Publication: US US20180331095A1
3D Chip Sharing Power Interconnect Layer
Application: 16/827,467 →
Publication: US US20200219771A1
3D Chip with Shared Clock Distribution Network
Application: 16/889,698 →
Publication: US US20200294858A1
Configurable Smart Object System with Magnetic Contacts and Magnetic Assembly
Application: 16/295,251 →
Publication: US US20190280428A1
Back biasing of FD-SOI circuit blocks
Application: 15/892,734 →
Publication: US US20190252375A1
Head Mounted Viewer for Ar and Vr Scenes
Application: 16/124,490 →
Publication: US US20200081250A1
Systems and methods for inter-die block level design
Application: 16/016,347 →
Publication: US US20190392104A1
Systems and Methods for Inter-Die Block Level Design
Application: 16/882,349 →
Publication: US US20200356714A1
Systems and Methods for Releveled Bump Planes for Chiplets
Application: 17/100,007 →
Publication: US US20210175206A1
Transistor Level Interconnection Methodologies Utilizing 3d Interconnects
Application: 16/265,456 →
Publication: US US20190305093A1
Hard IP Blocks WIth Physically Bidirectional Passageways
Application: 16/426,515 →
Publication: US US20190371708A1
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 22, 2016
From: DELACRUZ, JAVIER A.; PLANTS, WILLIAM C.
To: INVENSAS CORPORATION
Reel/Frame 040746/0371 →
Assignment of Assignor's Interest Mar 23, 2018
From: INVENSAS CORPORATION
To: XCELSIS CORPORATION
Reel/Frame 045335/0947 →
Assignment of Assignor's Interest Apr 13, 2018
From: TEIG, STEVEN L.; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 045536/0834 →
Assignment of Assignor's Interest Apr 13, 2018
From: TEIG, STEVEN L.; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 045536/0388 →
Assignment of Assignor's Interest Apr 13, 2018
From: TEIG, STEVEN L.; DUONG, KENNETH
To: XCELSIS CORPORATION
Reel/Frame 045537/0213 →
Assignment of Assignor's Interest Apr 13, 2018
From: TEIG, STEVEN L.; DUONG, KENNETH
To: XCELSIS CORPORATION
Reel/Frame 045537/0743 →
Assignment of Assignor's Interest Jul 11, 2018
From: MOHAMMED, ILYAS; TEIG, STEVEN L.; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 046324/0857 →
Assignment of Assignor's Interest Jul 11, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 046324/0903 →
Assignment of Assignor's Interest Jul 13, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 046347/0729 →
Assignment of Assignor's Interest Jul 13, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 046347/0555 →
Assignment of Assignor's Interest Jul 13, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 046348/0091 →
Assignment of Assignor's Interest Oct 27, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS; NEQUIST, ERIC M.
To: XCELSIS CORPORATION
Reel/Frame 047333/0649 →
Assignment of Assignor's Interest Oct 28, 2018
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS; NEQUIST, ERIC M.
To: XCELSIS CORPORATION
Reel/Frame 047333/0960 →
Assignment of Assignor's Interest Mar 27, 2019
From: HABA, BELGACEM; MOHAMMED, ILYAS; GUEVARA, GABRIEL Z.; TAO, MIN
To: XCELSIS CORPORATION
Reel/Frame 048719/0449 →
Assignment of Assignor's Interest Mar 2, 2020
From: MOHAMMED, ILYAS; TEIG, STEVEN L.; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 051984/0157 →
Assignment of Assignor's Interest Oct 5, 2020
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 053976/0091 →
Assignment of Assignor's Interest Jan 22, 2021
From: TEIG, STEVEN L.; DUONG, KENNETH; DELACRUZ, JAVIER
To: XCELSIS CORPORATION
Reel/Frame 055001/0787 →
Assignment of Assignor's Interest Feb 26, 2021
From: DELACRUZ, JAVIER; TEIG, STEVEN L.; MOHAMMED, ILYAS
To: XCELSIS CORPORATION
Reel/Frame 055423/0550 →