Patent Assignment
Reel/Frame 055001/0787
Assignment of Assignor's Interest
Recorded: 2021-01-22
Pages: 3
Assignors
TEIG, STEVEN L.
Executed: 2018-03-23
DUONG, KENNETH
Executed: 2018-03-19
DELACRUZ, JAVIER
Executed: 2018-03-20
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Time Borrowing Between Layers of a Three Dimensional Chip Stack
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.