Patent Assignment
Reel/Frame 055423/0550
Assignment of Assignor's Interest
Recorded: 2021-02-26
Pages: 3
Assignors
DELACRUZ, JAVIER
Executed: 2018-06-28
TEIG, STEVEN L.
Executed: 2018-06-27
MOHAMMED, ILYAS
Executed: 2018-06-27
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
3D Chip Sharing Power Interconnect Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.