Patent Assignment
Reel/Frame 045539/0587
Assignment of Assignor's Interest
Recorded: 2018-04-13
Pages: 3
Assignors
NAD, SUDDHASATTWA
Executed: 2018-04-12
MANEPALLI, RAHUL N.
Executed: 2018-04-12
WALL, MARCEL A.
Executed: 2018-04-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Circuit Device with Monolayer Bonding Between Surface Structures