Patent Assignment
Reel/Frame 045545/0935
Assignment of Assignor's Interest
Recorded: 2018-04-16
Pages: 3
Assignee
CHIPBOND TECHNOLOGY CORPORATION
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Chip on Film Package and Flexible Substrate Thereof