Patent Assignment
Reel/Frame 045554/0415
Assignment of Assignor's Interest
Recorded: 2018-04-16
Pages: 6
Assignors
HWANG, SUNG-MIN
Executed: 2018-02-02
LEE, DONG-SIK
Executed: 2018-02-12
LIM, JOON-SUNG
Executed: 2018-02-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device and Method of Fabricating the Same