Patent Assignment
Reel/Frame 045559/0201
Assignment of Assignor's Interest
Recorded: 2018-04-17
Pages: 10
Assignors
CHU, YI-SHIN
Executed: 2016-12-20
HUANG, KUAN-CHIEH
Executed: 2016-12-20
CHEN, PAO-TUNG
Executed: 2016-12-20
TSAI, SHUANG-JI
Executed: 2016-12-27
CHEN, YI-HAO
Executed: 2016-12-20
CHANG, FENG-KUEI
Executed: 2016-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Seal-Ring Structure for Stacking Integrated Circuits