Patent Assignment
Reel/Frame 045559/0502
Assignment of Assignor's Interest
Recorded: 2018-04-17
Pages: 7
Assignors
ZOU, QUANBO
Executed: 2016-10-24
AKRAM, SALMAN
Executed: 2016-09-12
BHAT, JEROME CHANDRA
Executed: 2016-09-09
TRIEU, MINH NGOC
Executed: 2016-10-24
BLANK, ROBERT J.
Executed: 2017-12-28
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property
(1)
Laser De-Bond of Carrier Wafer from Device Wafer
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
May 14, 2018
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 046148/0010 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →