Patent Assignment
Reel/Frame 045562/0796
Assignment of Assignor's Interest
Recorded: 2018-04-17
Pages: 4
Assignors
SATO, KAZUYA
Executed: 2018-02-28
HASHIMOTO, HIROMASA
Executed: 2018-02-26
KAMIHAMA, NAOKI
Executed: 2018-02-26
Assignee
SHIN-ETSU HANDOTAI CO., LTD
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Polishing Wafer and Polishing Apparatus