Patent Assignment
Reel/Frame 045564/0743
Assignment of Assignor's Interest
Recorded: 2018-04-17
Pages: 3
Assignor
LIAW, JHON JHY
Executed: 2018-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure in Semiconductor Devices