Patent Assignment
Reel/Frame 045566/0868
Assignment of Assignor's Interest
Recorded: 2018-04-18
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure Having Bridge Structure for Connection Between Semiconductor Dies and Method of Fabricating the Same