Patent Assignment
Reel/Frame 045566/0880
Assignment of Assignor's Interest
Recorded: 2018-04-18
Pages: 5
Assignors
CHEN, TSUI-MEI
Executed: 2018-03-26
TSAO, PEI-HAW
Executed: 2018-03-26
LIN, CHENG-TE
Executed: 2018-03-26
LIN, YU-JUNG
Executed: 2018-03-26
CHU, LI-HUAN
Executed: 2018-03-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Wafer Structure and Packaging Method
Patent:
10,283,424 →
Application:
15/916,210 →