Patent Assignment
Reel/Frame 045576/0421
Assignment of Assignor's Interest
Recorded: 2018-04-18
Pages: 7
Assignors
SUH, DONG CHAN
Executed: 2018-02-22
LEE, SANGMOON
Executed: 2018-02-22
KIM, YIHWAN
Executed: 2018-02-22
SONG, WOO BIN
Executed: 2018-02-22
SHIN, DONGSUK
Executed: 2018-03-06
LEE, SEUNG RYUL
Executed: 2018-02-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same