Patent Assignment
Reel/Frame 045590/0484
Assignment of Assignor's Interest
Recorded: 2018-04-19
Pages: 4
Assignor
DONG, WANLI
Executed: 2018-04-09
Assignees
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD.,CHAOYANG DISTRICT, BEIJING, 100015, CHINA
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO.1188, HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE, CHENGDU, SICHUAN, 611731, CHINA
Covered Property
(1)
Substrate to Be Encapsulated, Encapsulation Assembly and Display Device Having the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.