IP Library › Assignment 045606/0077
Patent Assignment
Reel/Frame 045606/0077

Assignment of Assignor's Interest

Recorded: 2018-03-15 Pages: 4
Assignors
YEOH, ANDREW W.
Executed: 2018-02-06
STEIGERWALD, JOSEPH
Executed: 2018-02-07
SHIN, JINHONG
Executed: 2018-02-07
CHIKARMANE, VINAY
Executed: 2018-02-12
HATTENDORF, MICHAEL L.
Executed: 2018-02-06
AUTH, CHRISTOPHER P.
Executed: 2018-02-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Heterogeneous Metal Line Compositions for Advanced Integrated Circuit Structure Fabrication
Application: 15/859,416 →
Publication: US 2019/0164897
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Remove the 5TH Inventor Previously Recorded at Reel: 45606 Frame: 77. Assignor(S) Hereby Confirms the Assignemtn. Aug 28, 2024
From: YEOH, ANDREW W.; STEIGERWALD, JOSEPH; SHIN, JINHONG; CHIKARMANE, VINAY
To: INTEL CORPORATION
Reel/Frame 068880/0881 →