Patent Assignment
Reel/Frame 045624/0023
Assignment of Assignor's Interest
Recorded: 2018-04-24
Pages: 2
Assignors
WU, YI-WEN
Executed: 2018-04-18
KUO, HUNG-JUI
Executed: 2018-04-18
HO, MING-CHE
Executed: 2018-04-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming Same