Patent Assignment
Reel/Frame 045635/0269
Assignment of Assignor's Interest
Recorded: 2018-04-25
Pages: 5
Assignors
LIM, JAE HYUN
Executed: 2018-04-12
KIM, HAN
Executed: 2018-04-12
JO, EUN JUNG
Executed: 2018-04-12
SHIM, JUNG HO
Executed: 2018-04-12
LEE, SANG JONG
Executed: 2018-04-12
KIM, HYUNG JOON
Executed: 2018-04-12
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Package on Package Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.