Patent Assignment
Reel/Frame 045636/0253
Assignment of Assignor's Interest
Recorded: 2018-04-25
Pages: 3
Assignors
OJHA, NIRDESH
Executed: 2018-03-27
RODRIGUEZ, FRANCISCO JAVIER SANTOS
Executed: 2018-03-27
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Methods of Thinning and Structuring Semiconductor Wafers by Electrical Discharge Machining