Patent Assignment
Reel/Frame 045636/0451
Assignment of Assignor's Interest
Recorded: 2018-04-25
Pages: 3
Assignor
KIRIHARA, NAOTOSHI
Executed: 2018-04-09
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Processing Wafer