Patent Assignment
Reel/Frame 045640/0383
Assignment of Assignor's Interest
Recorded: 2018-03-19
Pages: 2
Assignors
TSENG, SHIH-HAO
Executed: 2018-03-15
KUO, HUNG-JUI
Executed: 2018-03-15
HO, MING-CHE
Executed: 2018-03-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method