Patent Assignment
Reel/Frame 045654/0098
Assignment of Assignor's Interest
Recorded: 2018-04-27
Pages: 3
Assignor
SEDDON, MICHAEL J.
Executed: 2018-04-26
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Substrate Die Sawing Singulation Systems and Methods
Application:
15/964,496 →
Publication:
US 2019/0333818
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Oct 16, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047864/0611 →
Release of Security Interest in Patents Recorded at Reel 047864, Frame 0611
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064077/0298 →