Patent Assignment
Reel/Frame 064077/0298
Release of Security Interest in Patents Recorded at Reel 047864, Frame 0611
Recorded: 2023-06-23
Pages: 431
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
FAIRCHILD SEMICONDUCTOR CORPORATION
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(118)
Methods and Apparatus for Actuator Control
Transistor Device Having a Pillar Structure
Stacked Image Sensor Package
Methods and Apparatus for a Continuous Time Linear Equalizer
Method for Forming a Semiconductor Package
Efficient Buck-Boost Charge Pump and Method Therefor
Inductive Position Sensor
Semiconductor Power Module to Protect Against Short Circuit Event
Patent:
10,304,788 →
Application:
15/950,749 →
Image Sensor with Heating Effect and Related Methods
Application:
15/951,470 →
Publication:
US 2018/0233530
Power Semiconductor Device
Semiconductor Device and Method of Integrating Power Module with Interposer and Opposing Substrates
Semiconductor Device and Method of Integrating Power Module with Interposer and Opposing Substrates
Application:
15/954,353 →
Publication:
US 2018/0240786
Current Subtraction Circuitry
Image Sensors with Power Supply Noise Rejection Capabilities
Guard Rings for Cascode Gallium Nitride Devices
Semiconductor Die Singulation Methods
Methods and Systems of Detecting Failure Modes of Dc to Dc Power Converters
Patent:
10,236,771 →
Application:
15/955,899 →
Method and Apparatus for Controlling Wireless Induction Power Supply
Imaging Pixels with Microlenses
Resonance-Coupled Signaling Between Ic Modules
Application:
15/957,153 →
Publication:
US 2018/0240761
Molded Image Sensor Chip Scale Packages and Related Methods
Semiconductor Device and Method of Forming Cantilevered Protrusion on a Semiconductor Die
Application:
15/957,731 →
Publication:
US 2018/0240742
Semiconductor Wafer Thinning Systems and Related Methods
Patent:
10,388,526 →
Application:
15/958,123 →
Reverse Recovery Charge Reduction in Semiconductor Devices
Trench Power Mosfet Having a Trench Cavity
Patent:
10,304,933 →
Application:
15/960,819 →
Soi Substrate and Related Methods
Voltage Threshold Sensing Systems and Related Methods
Methods and Apparatus for Actuator Control
Methods and Apparatus for Actuator Control
Methods and Apparatus for Predictive Modeling in an Imaging System
Wafer Thinning Systems and Related Methods
Semiconductor Substrate Crack Mitigation Systems and Related Methods
Semiconductor Substrate Die Sawing Singulation Systems and Methods
Application:
15/964,496 →
Publication:
US 2019/0333818
Systems and Methods of Active Clamp Flyback Power Converters
Light Emitting Diode Control Circuit with Hysteretic Control and Low-Side Output Current Sensing
Patent:
10,051,699 →
Application:
15/964,684 →
Methods of Forming Semiconductor Packages with Back Side Metal
Communication Circuit for Flyback Power Converter with Synchronous Rectifier
Transceiver Methods and Systems with Pulse Generator Based on a Bootstrap Capacitor
Circuit and an Electronic Device Including a Transistor and a Component and a Process of Forming the Same
Variable Blanking Frequency for Resonant Converters
Heat Transfer for Power Modules
Direct Bonded Copper Semiconductor Packages and Related Methods
Reduction of Electromagnetic Interference in a Flyback Converter
Semiconductor Package and Related Methods
Synchronous Rectifier Controller for Offline Power Converter and Method Therefor
Switching Converter for Reducing Current Consumption in Sleep Mode
Overvoltage Protection Circuit for Usb Connector
Offline Converter with Power Factor Correction at Light Loads and Method Therefor
Patent:
10,312,799 →
Application:
15/974,392 →
Image Sensors Having Multi-Storage Image Sensor Pixels
Image Sensors with Non-Rectilinear Image Pixel Arrays
Methods and Apparatus for a Class-D Amplifier
Patent:
10,418,950 →
Application:
15/974,884 →
Methods and Apparatus for Determining a Resistance Value of a Resistor in a Battery System
Microlenses for High Dynamic Range Imaging Pixels
Singulation of Silicon Carbide Semiconductor Wafers
Electronic Device and Circuit Including a Transistor and a Variable Resistor
Method of Singulating Semiconductor Wafer Having a Plurality of Die and a Back Layer Disposed Along a Major Surface
Imaging Pixels with Plasmonic Color Filter Elements
Apparatus and Methods for Generating High Dynamic Range Images
Packaged Semiconductor Devices with Laser Grooved Wettable Flank and Methods of Manufacture
Hybrid Gate Dielectrics for Semiconductor Power Devices
Quasi-Resonant Converter with Efficient Light-Load Operation and Method Therefor
Semiconductor Substrate Singulation Systems and Related Methods
Semiconductor Substrate Processing Methods
Die Singulation Systems and Methods
Application:
15/988,262 →
Publication:
US 2019/0363020
Die Sawing Singulation Systems and Methods
Application:
15/988,718 →
Publication:
US 2019/0363017
Die Cleaning Systems and Related Methods
Application:
15/988,874 →
Publication:
US 2019/0363018
Charge Packet Signal Processing Using Pinned Photodiode Devices
Image Sensors with Light Flicker Mitigation Capabilities
Image Sensors Having Dummy Pixel Rows
Amplifier with Common Mode Loop and Chop
Patent:
10,396,724 →
Application:
15/993,063 →
Package Structure with Multiple Substrates
Led Driving Device
Semiconductor Substrate Production Systems and Related Methods
Patent:
10,468,304 →
Application:
15/994,864 →
Image Sensors with Charge Overflow Capabilities
Compensation of Input Current of Ldo Output Stage
Patent:
10,185,344 →
Application:
15/995,441 →
Process of Forming an Electronic Device Including an Access Region
Asymmetric Angular Response Pixels for Singl Sensor Stereo
Application:
15/997,851 →
Publication:
US 2018/0288398
Methods and Apparatus for Driver Calibration
Methods and Apparatus for Actuator Control
Methods and Apparatus for Actuator Control
Image Sensors with Multi-Photodiode Image Pixels and Vertical Transfer Gates
Resonant Converter and Driving Method Thereof
Semiconductor Device Having Biasing Structure for Self-Isolating Buried Layer and Method Therefor
Methods and Apparatus for a Biosensor
Lin-Compatible Fast-Data Bus
Voltage Translator Using Low Voltage Power Supply
Voltage Translator Device
Patent:
10,277,226 →
Application:
16/005,298 →
Backside Illuminated Global Shutter Pixels
Patent:
10,432,883 →
Application:
16/005,887 →
Primary Side Constant Current Regulation
Patent:
10,483,860 →
Application:
16/007,364 →
High Dynamic Range Imaging Pixels with Multiple Exposures
Patent:
10,356,344 →
Application:
16/008,221 →
Power Device Having Super Junction and Schottky Diode
Method and System of a Resonant Power Converter
Auto-Tuning Current Limiter
Semiconductor Package with Integrated Heat Sink
Application:
16/013,397 →
Publication:
US 2019/0393127
Imaging Systems with High Dynamic Range and Phase Detection Pixels
Pixel Control Signal Verification in a Stacked Image Sensor
Backside Illumination Image Sensors
Methods and Systems of a Rectifier Circuit
Semiconductor Device Package with Clip Interconnect and Dual Side Cooling
Method for Forming Ohmic Contacts
Termination Structure for Insulated Gate Semiconductor Device and Method
Patent:
10,439,075 →
Application:
16/020,719 →
Average Current and Frequency Control
Converter and Driving Method Thereof
Temperature-Compensated Low-Voltage Bandgap Reference
Imaging Systems with Depth Detection
Valley Detection for Totem Pole Bridgeless Pfc
Application:
62/655,592 →
Current Sensing Technique for Totem Pole Bridgeless Pfc
Application:
62/655,598 →
Robust Speech Classifier in Ultra-Low Processing Power Setting
Application:
62/659,937 →
System for and Method of Manufacture Using Multimodal Analysis
Application:
62/664,797 →
Predictive Resonance Control for a Dickson Converter
Application:
62/665,294 →
Neural Network Accelerator
Application:
62/665,318 →
High Power Module Package Structures
Application:
62/665,598 →
Package Structure with Multiple Substrates
Application:
62/670,506 →
Reconfigurable Mimo Radar
Application:
62/684,982 →
Computationally Efficient Sub-Band Music Classifier
Application:
62/688,726 →
Method of Reducing Residual Contamination in Singulated Semiconductor Die
Application:
62/689,481 →
Safety (Ir) Led Driver with Limited Exposure Time and Frequency Limitation
Application:
62/689,599 →
Circuits, Systems, and Methods for Low Loss
Application:
62/689,752 →
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 2, 2018
From: TABUCHI, YOSHIHISA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045410/0850 →
Assignment of Assignor's Interest
Apr 3, 2018
From: OGURA, TAKASHI; SOMA, MITSURU; PROBST, DEAN E.; HIROSHIMA, TAKASHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045423/0023 →
Assignment of Assignor's Interest
Apr 3, 2018
From: PHAM, PHUC CONG; NGUYEN, HIEU; COMER, ROD J.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045428/0717 →
Assignment of Assignor's Interest
Apr 3, 2018
From: WU, WENG-JIN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045428/0619 →
Assignment of Assignor's Interest
Apr 4, 2018
From: PRAJUCKAMOL, ATAPOL; YAO, YUSHUANG; CHEW, CHEE HIONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045440/0216 →
Assignment of Assignor's Interest
Apr 9, 2018
From: HUKEL, MIROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045477/0688 →
Assignment of Assignor's Interest
Apr 10, 2018
From: BERTIN, JACQUES JEAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045496/0126 →
Assignment of Assignor's Interest
Apr 12, 2018
From: LENCHENKOV, VICTOR; SOLEIMANI, HAMID
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045520/0546 →
Assignment of Assignor's Interest
Apr 13, 2018
From: KIM, HYE-MI
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 045536/0680 →
Assignment of Assignor's Interest
Apr 13, 2018
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045940/0190 →
Assignment of Assignor's Interest
Apr 16, 2018
From: ZHOU, JINCHANG; LIN, YUSHENG; LIU, MINGJIAO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045555/0520 →
Assignment of Assignor's Interest
Apr 16, 2018
From: ZHOU, JINCHANG; LIN, YUSHENG; LIU, MINGJIAO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045555/0370 →
Assignment of Assignor's Interest
Apr 17, 2018
From: JEON, WOOCHUL; SALIH, ALI; LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045566/0210 →
Assignment of Assignor's Interest
Apr 17, 2018
From: SEDDON, MICHAEL JOHN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045566/0309 →
Assignment of Assignor's Interest
Apr 17, 2018
From: THOMAS, KYLE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045565/0163 →
Assignment of Assignor's Interest
Apr 17, 2018
From: SUZUKI, KAZUHISA
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045566/0068 →
Assignment of Assignor's Interest
Apr 18, 2018
From: PLOJHAR, JAN; HORSKY, PAVEL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045571/0649 →
Assignment of Assignor's Interest
Apr 19, 2018
From: FAIRCHILD (TAIWAN) CORPORATION (FORMERLY SYSTEM GENERAL CORPORATION)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045985/0478 →
Assignment of Assignor's Interest
Apr 19, 2018
From: YANG, TA-YUNG
To: SYSTEM GENERAL CORP.
Reel/Frame 045591/0861 →
Change of Name
Apr 19, 2018
From: SYSTEM GENERAL CORP.
To: FAIRCHILD (TAIWAN) CORPORATION
Reel/Frame 045985/0330 →
Patent Security Agreement
Oct 16, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047864/0611 →
Assignment of Assignor's Interest
Mar 5, 2019
From: KIM, JIHWAN; YANG, GWIGYEON; ZSCHIESCHANG, OLAF
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048509/0421 →
Assignment of Assignor's Interest
Mar 5, 2019
From: FAIRCHILD KOREA SEMICONDUCTOR LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048509/0593 →