IP Library › Patent Application 62665598
Patent Application Provisional
App. No. 62/665,598 · Confirmation No. 9967

HIGH POWER MODULE PACKAGE STRUCTURES

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2018-05-10 APP.FILE.REC Filing Receipt 3 View
2018-05-02 ADS Application Data Sheet 8 View
2018-05-02 SPEC Specification 19 View
2018-05-02 CLM Claims 3 View
2018-05-02 DRW Drawings-only black and white line drawings 24 View
2018-05-02 DRW.NONBW Drawings-other than black and white line drawings 24 View
2018-05-02 WFEE Fee Worksheet (SB06) 2 View
2018-05-02 N417 Electronic Filing System Acknowledgment Receipt 3 View
2018-05-02 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2018-05-02 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
62/665,598
Filed
2018-05-02