IP Library Granted Patent US 10,312,359
Granted Patent B2
US 10,312,359 · App. 15/955,555 · Granted Jun 4, 2019

Guard rings for cascode gallium nitride devices

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Quick Facts
Patent No.
US 10,312,359
App. No.
15/955,555
Granted
Jun 4, 2019
Kind
B2
Abstract

Implementations of semiconductor devices may include: a plurality of drain fingers and a plurality of source fingers interdigitated with one another; at least one gate; and at gate bus formed to completely surround the plurality of drain fingers and the plurality of source fingers; wherein the gate bus is mechanically and electrically coupled to the at least one gate.

Claims (37)

1. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gates;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a gate bus formed as a guard ring of the D-mode transistor;

wherein the gate bus is coupled with one or more gate pads of the D-mode transistor; and

wherein the one or more gate pads of the D-mode transistor couple with the source pads of the E-mode transistor and an electrical ground.

2. The semiconductor device of claim 1 , wherein the D-mode transistor is a gallium nitride (GaN) high electron mobility transistor (HEMT).

3. The semiconductor device of claim 1 , wherein the E-mode transistor is a silicon (Si) field effect transistor (FET).

4. The semiconductor device of claim 1 , further comprising a second guard ring surrounding an outer perimeter of the guard ring of the D-mode transistor.

5. The semiconductor device of claim 1 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

6. The semiconductor device of claim 1 , further comprising a pin out from each of the drain of the D-mode transistor and the gate and the source of the E-mode transistor.

7. The semiconductor device of claim 1 , wherein the source of the D-mode transistor is coupled to the drain of the E-mode transistor.

8. The semiconductor device of claim 1 , wherein the source of the D-mode transistor and the drain of the E-mode transistor are coupled together through a wire bond.

9. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gates;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a gate bus formed as a guard ring of the D-mode transistor;

wherein the gate bus is coupled with one or more gate pads of the D-mode transistor; and

wherein the one or more gate pads of the D-mode transistor couple with the source pads of the E-mode transistor and an electrical ground; and

wherein the source is not grounded.

10. The semiconductor device of claim 9 , wherein the D-mode transistor is a gallium nitride (GaN) high electron mobility transistor (HEMT).

11. The semiconductor device of claim 9 , wherein the E-mode transistor is a silicon (Si) field effect transistor (FET).

12. The semiconductor device of claim 9 , further comprising a second guard ring surrounding an outer perimeter of the guard ring of the D-mode transistor.

13. The semiconductor device of claim 9 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

14. The semiconductor device of claim 9 , further comprising a pin out from each of the drain of the D-mode transistor and the gate and the source of the E-mode transistor.

15. The semiconductor device of claim 9 , wherein the source of the D-mode transistor is coupled to the drain of the E-mode transistor.

16. The semiconductor device of claim 9 , wherein the source of the D-mode transistor and the drain of the E-mode transistor are coupled together through a wire bond.

17. A semiconductor device comprising:

a depletion mode (D-mode) transistor comprising one or more source fingers, one or more drain fingers and one or more gates;

an enhanced mode (E-mode) transistor comprising one or more source pads, one or more drain pads and one or more gate pads; and

a gate bus formed as a guard ring of the D-mode transistor;

a second guard ring surrounding an outer perimeter of the first guard ring;

wherein the gate bus is coupled with one or more gate pads of the D-mode transistor; and

wherein the one or more gate pads of the D-mode transistor couple with the source pads of the E-mode transistor and an electrical ground.

18. The semiconductor device of claim 17 , wherein a channel between the gate bus and the second guard ring is depleted.

19. The semiconductor device of claim 17 , wherein a channel between the gate bus and the second guard ring is active.

20. The semiconductor device of claim 17 , wherein the D-mode transistor is coupled to a first conductive lead frame and the E-mode transistor is coupled to a second conductive lead frame.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 047864, FRAME 0611 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064077/0298 →
PATENT SECURITY AGREEMENT Recorded Oct 16, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047864/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2018
From: JEON, WOOCHUL; SALIH, ALI; LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 045566/0210 →