Power device having super junction and schottky diode

1. A power semiconductor device, comprising:

a semiconductor layer having a first conductivity type;

a trench defined within the semiconductor layer, the trench having an opening, a sidewall and a base;

a pillar provided below the trench and having a second conductivity type that is different than the first conductivity type;

a well having the second conductivity type and provided over and spaced apart from the pillar;

a metal layer provided over the sidewall of the trench, the metal layer contacting the semiconductor layer at a gap that defines a distance between the well and the pillar to form a Schottky interface of a Schottky diode;

a first electrode provided over a first side of the semiconductor layer; and

a second electrode provided over a second side of the semiconductor layer.

2. The power semiconductor device of claim 1 , wherein the semiconductor layer provides a vertical current path between the first and second electrodes, and the first electrode serves as an anode of the Schottky diode and the second electrode serves as a cathode of the Schottky diode, and

wherein the semiconductor layer is an epi layer formed over a substrate.

3. The power semiconductor of claim 2 , wherein the substrate includes an epi layer.

4. The power semiconductor device of claim 1 , further comprising:

a gate electrode provided over the semiconductor layer,

wherein the first electrode is provided proximate the gate and extends into the trench and electrically couples to the metal layer, and the second electrode is provided below the pillar, and

wherein the semiconductor layer provides a vertical current path between the first and second electrodes, and the first conductivity is a N type conductivity and the second conductivity is a P type conductivity.

5. The power semiconductor device of claim 3 , wherein the power device is a MOSFET and the first and second electrodes are source and drain electrodes, respectively, and the pillar is a super junction pillar having a depth of at least 25 microns.

6. The power semiconductor device of claim 4 , further comprising:

an enhancement region within the semiconductor layer and between the well and the pillar, the enhancement region having the first conductivity type and a doping concentration that is greater than that of the semiconductor layer.

7. The power semiconductor of claim 5 , wherein the trench extends into an upper portion of the pillar so that the base of the trench is provided inside of the pillar.

8. The power semiconductor device of claim 1 , wherein the trench extends into an upper portion of the pillar so that the base of the trench is provided inside of the pillar, wherein the power semiconductor device further comprises:

an Ohmic contact region provided below the base of the trench and within the pillar.

9. The power semiconductor device of claim 1 , further comprising:

an enhancement region provided in the gap, the enhancement region having the first conductivity type and a doping concentration that is greater than that of the semiconductor layer.

10. The power semiconductor device of claim 9 , wherein the doping concentration in the enhancement region is from 1.2×10 16 cm −3 to 5×10 17 cm −3 .

11. The power semiconductor device of claim 8 , wherein the Ohmic contact region has the second conductivity type and a doping concentration of the Ohmic contact region is greater than that of the pillar.

12. A power semiconductor device, comprising:

a substrate having an upper side and a lower side;

a first electrode disposed over the upper side of the substrate;

a second electrode disposed below the lower side of the substrate;

an epi layer formed over the substrate and between the first and second electrodes, the epi layer having a pillar and a well, the pillar and the well defining a gap;

a trench disposed over the pillar having a sidewall and a base, the base of the trench being recessed into the pillar; and

a metal contact layer disposed over the base and the sidewall of the trench, the metal contact layer contacting the epi layer at the gap defined by the pillar and the well, thereby defining a Schottky interface at the gap.

13. The power semiconductor device of claim 12 , further comprising:

an enhancement region provided between the well and the pillar, and proximate the Schottky interface.

14. The power semiconductor device of claim 12 , further comprising:

an Ohmic contact region provided below the base of the trench and within the pillar so that the metal contact layer forms an Ohmic contact with the Ohmic contact region.

15. The power semiconductor device of claim 14 , wherein a Schottky diode is defined by the epi layer and the metal contact layer, and

wherein the first electrode corresponds to an anode of the Schottky diode, and the second electrode corresponds to a cathode of the Schottky diode.

16. The power semiconductor device of claim 12 , wherein the power semiconductor device is a MOSFET.

17. The power semiconductor device of claim 12 , wherein the power semiconductor device is an IGBT.

18. The power semiconductor device of claim 12 , further comprising:

an enhancement region provided in the gap, the enhancement region having the first conductivity type and a doping concentration that is greater than that of the epi layer.

19. The power semiconductor device of claim 18 , wherein the doping concentration in the enhancement region is from 1.2×10 16 cm −3 to 5×10 17 cm −3 .

20. The power semiconductor device of claim 14 , wherein the Ohmic contact region has the second conductivity type and a doping concentration of the Ohmic contact region is greater than that of the pillar.