Heat transfer for power modules
In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.
1. An apparatus, comprising:
a module including a semiconductor die;
a heatsink coupled to the module and including:
a substrate, and
a plurality of protrusions;
a first cover defining a first channel, the plurality of protrusions of the heatsink being disposed within the first channel defined by the first cover;
a second cover defining a second channel,
the first cover being coupled to the module and in contact with the module via a sealing mechanism disposed between the first cover and the module, the module separating the first channel from the second channel.
2. The apparatus of claim 1 , wherein the first cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the first channel.
3. The apparatus of claim 1 , wherein the heatsink is a first heatsink, the first cover and the first heatsink are on a first side of the module,
the apparatus, further comprising:
a second heatsink coupled to a second side of the module,
the second heatsink being disposed within the second channel.
4. The apparatus of claim 3 , wherein the first cover is coupled to the second cover via a coupling mechanism disposed lateral to the module.
5. The apparatus of claim 1 , wherein the module is a first module, the heatsink is a first heatsink,
the apparatus further comprising:
a second module;
a second heatsink coupled to the second module, the second heatsink having a plurality of protrusions within the first channel, the first heatsink and the second heatsink being aligned along the first channel.
6. The apparatus of claim 1 , wherein the plurality of protrusions including at least one protrusion having an end separated from an inner surface of the first channel by a gap.
7. The apparatus of claim 1 , wherein the sealing mechanism is in contact with the substrate of the heatsink.
8. The apparatus of claim 1 , further comprising:
a coupling mechanism coupling the first cover to the substrate of the heatsink.
9. The apparatus of claim 1 , wherein the sealing mechanism is in contact with at least a portion of the module.
10. The apparatus of claim 1 , wherein the sealing mechanism includes an o-ring disposed within a groove included in the first cover.
11. The apparatus of claim 1 , wherein the module is aligned along a first plane, the sealing mechanism is aligned along a second plane, the sealing mechanism is disposed along a perimeter of the module.
12. The apparatus of claim 1 , wherein the heatsink includes a first metal and a second metal.
13. The apparatus of claim 1 , wherein the module is a dual-sided module including a direct bonded metal substrate.
14. The apparatus of claim 1 , wherein the module includes a direct bonded metal substrate in contact with the semiconductor die, the direct bonded metal substrate includes a dielectric layer disposed between a pair of metal layers.
15. An apparatus, comprising:
a module including a semiconductor die;
a first cover including:
a first channel defined by the first cover, and
a plurality of protrusions extending from an inner surface of the first cover into the first channel;
a second cover including a second channel,
the first cover being coupled to the module and in contact with the module via a sealing mechanism disposed between the first cover and the module, the module separating the first channel from the second channel.
16. The apparatus of claim 15 , wherein an end of at least one of the plurality of protrusions is separated from a surface of the module by a gap.
17. The apparatus of claim 15 , wherein the first cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the first channel.
18. The apparatus of claim 15 , wherein the first cover includes an inlet opening and an outlet opening in fluid communication with the inlet opening via the first channel, the module is a first module,
the apparatus, further comprising:
a second module, the first module and the second module being aligned along the first channel between the inlet opening and the outlet opening.
19. A method comprising:
forming a module including:
a semiconductor die encapsulated in a molding material, and
a direct bonded metal substrate having an inner surface electrically coupled to the semiconductor die; and
coupling a first cover to at least a first portion of the module and a second cover to at least a second portion of the module such that:
a heat-transfer mechanism is disposed within a first channel defined by the first cover between a wall of the first cover and the module, and
the module separates the first channel from a second channel defined by the second cover.
20. The method of claim 19 , wherein the heat-transfer mechanism is a heatsink coupled to the first cover or the module before the first cover is coupled around the module.
21. The method of claim 19 , wherein the heat-transfer mechanism includes a cover protrusion extending from the first cover.