Patent Assignment
Reel/Frame 045658/0324
Assignment of Assignor's Interest
Recorded: 2018-04-27
Pages: 4
Assignors
NAKAKO, HIDEO
Executed: 2018-03-10
KURAFUCHI, KAZUHIKO
Executed: 2018-03-10
EJIRI, YOSHINORI
Executed: 2018-03-21
ISHIKAWA, DAI
Executed: 2018-04-12
SUGAMA, CHIE
Executed: 2018-03-27
KAWANA, YUKI
Executed: 2018-03-27
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Assembly and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →