IP Library Assignment 045660/0887
Patent Assignment
Reel/Frame 045660/0887

Assignment of Assignor's Interest

Recorded: 2018-04-27 Pages: 4
Assignors
KIM, SEOK HWAN
Executed: 2018-04-05
KIM, HAN
Executed: 2018-04-05
LEE, KYUNG HO
Executed: 2018-04-05
JUNG, KYUNG MOON
Executed: 2018-04-05
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package for Reducing Stress to Redistribution Via
Application: 15/965,590 →
Publication: US 2019/0189579
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →