Patent Assignment
Reel/Frame 045663/0503
Assignment of Assignor's Interest
Recorded: 2018-04-29
Pages: 10
Assignors
CHEN, KAI-PING
Executed: 2018-04-25
FENG, LI-WEI
Executed: 2018-04-25
YU, KUEI-HSUAN
Executed: 2018-04-25
YEH, CHIU-HSIEN
Executed: 2018-04-25
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Device and Method of Forming the Same