Patent Assignment
Reel/Frame 045669/0226
Assignment of Assignor's Interest
Recorded: 2018-04-30
Pages: 11
Assignors
COLLINS, ANDREW
Executed: 2018-04-02
MALLIK, DEBENDRA
Executed: 2018-03-30
MANUSHAROW, MATHEW J
Executed: 2018-04-05
XIE, JIANYONG
Executed: 2018-04-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Power-Delivery Methods for Embedded Multi-Die Interconnect Bridges and Methods of Assembling Same