Patent Assignment
Reel/Frame 045670/0484
Assignment of Assignor's Interest
Recorded: 2018-04-30
Pages: 3
Assignors
CHEN, FANG
Executed: 2018-03-30
LIAW, JHON JHY
Executed: 2018-03-30
LIANG, MIN-CHANG
Executed: 2018-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure for Logic Circuit