IP Library Assignment 045677/0552
Patent Assignment
Reel/Frame 045677/0552

Assignment of Assignor's Interest

Recorded: 2018-05-01 Pages: 4
Assignors
LEE, YUN TAE
Executed: 2018-04-19
KIM, HAN
Executed: 2018-04-18
KIM, HYUNG JOON
Executed: 2018-04-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Connection System of Semiconductor Packages
Application: 15/966,673 →
Publication: US 2019/0043835
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →